| No | Items | SPEC |
| 1 | Trace Width/Space | 35μm /35μm |
| 2 | Trace Width Tolerance | ±10％ |
| 3 | Distance between Pad and Conductor | 0.075mm |
| 4 | Distance between Board Edge and Conductor | 0.15mm |
| 5 | Min. Pad Size | 0.3*0.3mm |
| 6 | PTH Pad Size | 0.25mm |
| 7 | Min. PTH Aperture | 0.05mm |
| 8 | Registration of Silk-Screen | ±0.075mm |
| 9 | Tolerance of External Dimension | ±0.05mm |
| 10 | Tolerance of Aperture | ±0.015mm |
| 11 | Registration of Hole | ±0.025mm |
| 12 | Thickness of Ni Plating | 1μm-5μm |
| 13 | Thickness of Au Plating | 0.05μm-0.2μm |
| 14 | Maximum Layer | 8 Layers |
| 项目 | 量产能力 | |
| Chip器件 | 可加工最小尺寸电阻、电容电感 | 0201 |
| SMT加工直通率 | 99.95% | |
| 连接器 | 可加工最小Pitch 连接器 | 0.4mm |
| SMT加工直通率 | 99.80% | |
| BGA | 可加工最小Pitch BGA器件 | 0.4mm |
| SMT加工直通率 | 99.80% | |
| QFN | 可加工最小Pitch QFN器件 | 0.4mm |
| SMT加工直通率 | 99.80% | |
| LED | LED灯贴装角度精度 | ±1° |
| SMT加工直通率 | 99.90% | |
